Transient Simulation of Diffusion-Limited Electrodeposition Using Volume of Fluid (VOF) Method

A numerical model utilizing the volume of fluid (VOF) method is proposed to simulate transient shape changes deposit front, considering diffusion-limited electrodeposition process. Modeling equations are accurately handle transport phenomena in both electrolyte (fluid) and (solid). Transient evolutions field structures, including flow, concentration, electric current density, potential, computed electrodeposited copper bumps. Two cases, single cavity multiple cavities, studied. Based on modeling results, maximum height hump thickness deposited layer each consecutive decreases going from upstream downstream. Conversely, location remains unchanged all cavities. Results validated against available experiments.